Epoxy resin compositions cured with imide-amine at ambient temperatures to afford products having useful properties at high temperatures

ABSTRACT

Imide-amides having the structure ##STR1## wherein ##STR2## are certain cycloaliphatic or aromatic groups and R and R individually are hydrogen, halogen, an alkyl group having from 1 to 4 carbon atoms, hydroxy, carboxyl, and amine and when taken together represent ##STR3## wherein R 2  is the same as R and R 1 , have been found to provide cured epoxy resin systems characterized by high temperature stability and excellent mechanical and physical properties.

This is a division of application Ser. No. 267,149; filed May 26, 1981,and now U.S. Pat. No. 4,340,715 issued July 20, 1982.

BACKGROUND OF THE INVENTION

1. Field of the Invention

This invention relates to epoxy resin compositions. More particularly,the invention relates to epoxy resin compositions which are curable atambient temperatures to afford products having useful properties at hightemperatures.

2. Description of the Prior Art

Epoxy resins are among the most versatile of the plastic materials.Because of their toughness, adhesion, chemical resistance and electricalproperties, the combination of which is not found in any other singleorganic polymeric material, the epoxy resins are widely used in coating,adhesives, casting, molding, laminating, potting and encapsulation, andreinforced plastic applications. In general, the epoxy resin is not usedby itself but requires the addition of a curing agent or hardner toconvert the resin to a crosslinked material. Curing agents which arecommonly employed with epoxy resins include aliphatic and aromaticamines, polyamides, tertiary amines, amine adducts, acids, acidmonoanhydrides, acid dianhydrides, aldehyde condensation products, andLewis acid type catalysts. Selection of an appropriate curing agentdepends upon system requirements such as mixture viscosity, system massand temperature, and the characteristics desired in the cured resin suchas resistance to temperature and chemicals, electrical properties, andthe like.

In recent years, there has been an increasing demand from the aerospaceindustry and other industrial applications for materials havinghigh-temperature utility. High-temperature utility can be improvedthrough the use of anhydride and certain amine curing agents at elevatedcuring cycles, as well as through the use of epoxy resins obtained bythe epoxidation, with peroxy compounds, of double bonds in certainDiels-Alder adducts. However, in many applications the high-temperatureutility is insufficient. Studies indicate that temperature resistance,as well as chemical and heat resistance, is a function of crosslinkdensity of the cured resin, with higher crosslink density affordingimprovements in these properties. Higher crosslink density can beachieved by increasing the functionality of either the epoxy resin orthe hardening agent.

Polyimides based on all aromatic ring structures are known to impartimproved high temperature resistance as well as increased chemical andsolvent resistance, to cured epoxy resin compositions. Unfortunately,these aromatic polyimides suffer from the drawback that they aregenerally high melting solids which are not soluble to any appreciableextent in common solvents or epoxy resins and therefore are difficult toincorporate in epoxy resins except at elevated temperatures. Inaddition, epoxy resin compositions containing these aromatic polyimidesas curing agents require high temperature curing cycles.

Thus, there is a continuing search for new epoxy resins and curingagents which can be cured at low temperatures to afford cured resinsystems having good high temperature stability.

BRIEF SUMMARY OF THE INVENTION

In accordance with the present invention, it has been found that certainimide-amine curing agents can be readily incorporated into epoxy resinsto afford epoxy compositions curable at room temperature to providecured epoxy systems characterized by high temperature stability andexcellent mechanical and physical properties. Because the epoxy resincompositions of the invention are curable at room temperature, thecompositions of the invention are advantageous provided as a two-packepoxy resin system comprising

(a) a first pack comprising an imide-amine having the structure ##STR4##wherein -- 1 -- is a divalent cycloaliphatic or aromatic radicalselected from the group consisting of ##STR5## is a tetravelanetcycloaliphatic or aromatic radical selected from the group consisting of##STR6## R and R¹ can be the same or different and each is selected fromthe group consisting of hydrogen, halogen, alkyl group having from 1 to4 carbon atoms, hydroxyl, carboxyl and amine and when taken together, Rand R¹ are ##STR7## wherein R² is the same as R and R¹ ; with theproviso that, in all cases, either ##STR8##

(b) a second pack comprising an epoxy resin substantially free of activehydrogen having a 1,2 epoxy equivalent value of greater than 1 andcapable of solubilizing said imide-amine.

DETAILED DESCRIPTION OF THE INVENTION

The imide-amines which are employed in the practice of the presentinvention are normally solid compounds prepared by reacting acycloaliphatic or aromatic diamine having the structure:

    H.sub.2 N-- 1 --NH.sub.2

wherein -- 1 -- is as defined above, with a cycloaliphatic or aromatictetracarboxylic acid dianhydride having the structure: ##STR9##(hereinafter referred to as "dianhydride") wherein 1 is as defined aboveor with a cycloaliphatic or aromatic monoanhydride having the structure:##STR10## wherein ##STR11## and R and R¹ are as defined above. Thereaction of the anhydride and diamine to provide the imide-amine curingagents can be carried out by first adding a solution of the anhydride toa solution of the diamine to form the corresponding hydroxamic acid.This reaction to the hydroxamic acid proceeds readily at roomtemperature but elevated temperatures can be employed to hasten thereaction, if desired. The resulting hydroxamic acid is then condensed tothe desired imide-amine by simply heating the hydroxamic acid to anelevated temperature, for instance, above 180° C. Alternatively, theconversion to the imide-amine can be effected at lower temperatures bythe use of appropriate solvents, for example, a mixture of pyridine andacetic anhydride pursuant to condensation methods and techniques wellknown in the art.

The imide-amines of the invention fall into one of the following fourclasses of compounds: ##STR12##

In each of the above cases I-IV, ##STR13## R, R¹ and R² are as definedabove.

The imide-amine curing agents of Class I of the invention may beprepared by reacting two moles of the cycloaliphatic or aromatic H₂ N --1 -- NH₂ per mole of dianhydride. Class II compounds wherein R² is otherthan NH₂ may be prepared by reacting one mole of the diamine H₂ N -- 1-- NH₂ with one mole of dianhydride and then with one mole of R² -- 1 --NH₂ wherein R² and -- 1 -- are as defined above. Class III compounds maybe prepared by reacting one mole of the diamine H₂ N -- 1 -- NH₂ withone mole of dianhydride and then with one mole of R² NH₂ wherein R² isas defined above. Class IV compounds are RNH₂ wherein R is as definedabove. Class IV compounds are prepared by reacting one mole of thediamine H₂ N -- 1 -- NH₂ with one mole of the monoanhydride, ##STR14##wherein ##STR15## R and R¹ are as defined above.

Illustrative of suitable dianhydrides for use in the preparation of theimide-amine curing agents are cyclobutane tetracarboxylic dianhydride,benzene-1,2,4,5-tetracarboxylic dianhydride,cyclopentane-1,2,3,5-tetracarboxylic dianhydride,3,6-dimethylbenzene-1,2,4,5-tetracarboxylic dianhydride,3-methylcyclobenzene-1,2,4,5-tetracarboxylic dianhydride,3-chlorobenzene-1,2,4,5-tetracarboxylic dianhydride,3-ethylbenzene-1,2,4,5-tetracarboxylic dianhydride,3-aminobenzene-1,2,4,5-tetracarboxylic dianhydride,3-amino-6-methylbenzene-1,2,4,5-tetracarboxylic dianhydride,6-hydroxybenzene-1,2,4,5-tetracarboxylic dianhydride,3-benzenecarboxylic acid-1,2,4,5-tetracarboxylic dianhydride,cyclohexane-1,2,4,5-tetracarboxylic acid dianhydride,3,6-dimethylcyclohexane-1,2,4,5-tetracarboxylic acid dianhydride,3-chlorocyclohexane-1,2,4,5-tetracarboxylic acid dianhydride,3-ethylcyclohexane-1,2,4,5-tetracarboxylic acid dianhydride,3-aminocyclohexane-1,2,4,5-tetracarboxylic acid dianhydride,3-hydroxycyclohexane-1,2,4,5-tetracarboxylic acid dianhydride and3-cyclohexane carboxylic acid-1,2,4,5-tetracarboxylic acid dianhydride.

Illustrative of suitable monoanhydrides for use in the preparation ofthe imide-imine curing agents are: cyclobutane dicarboxylic acidmonoanhydride, benzene dicarboxylic acid monoanhydride, cyclopentanedicarboxylic acid monoanhydride, 3,6-dimethyl benezene-1,2-dicarboxylicacid monoanhydride, 3-chlorobenzene-1,2-dicarboxylic acid monoanhydride,3-ethylbenzene-1,2-dicarboxylic acid monoanhydride,3-aminobenzene-12,-dicarboxylic acid monoanhydride,6-hydroxybenzene-1,2-dicarboxylic acid monoanhydride,3,6-dimethylcyclohexane-1,2-dicarboxylic acid monoanhydride,3-ethylcyclohexane-1,2-dicarboxylic acid monoanhydride,3-aminocyclohexane-1,2-dicarboxylic acid monoanhydride, 3-cyclohexanecarboxylic acid-1,2-dicarboxylic acid monoanhydride.

Examples of diamines that can be used in the preparation of theimide-amines of the invention are: 1,2-cyclobutane diamine,2-chloro-1,3-cyclobutane diamine, 2-methyl-1,3-cyclobutane diamine,2,4-dimethyl-1,3-cyclobutane diamine, 2-ethyl-1,3-cyclobutane diamine,2-amino-1,3-cyclobutane diamine, 2-hydroxy-1,3-cyclobutane diamine,2,4-dihydroxy-1,3-cyclobutane diamine, 2-carboxylic acid-1,3-cyclobutanediamine, 1,2-cyclobutane diamine, 2-chloro-1,2-cyclobutane diamine,2-methyl-1,2-cyclobutane diamine, 2,4-dimethyl-1,2-cyclobutane diamine,2-ethyl-1,2-cyclobutane diamine, 2-amino-1,2-cyclobutane diamine,2-hydroxy-1,2-cyclobutane diamine, 2,4-dihydroxy-1,2-cyclobutanediamine, 2-carboxylic acid-1,2-cyclobutane diamine, p-phenylene diamine,2-chloro-1,4-phenylene diamine, 2-methyl-1,4-phenylene diamine,2,4-dimethyl-1,4-phenylene diamine, 2-ethyl-1,4-phenylene diamine,2-amino-4-phenylene diamine, 2-hydroxy-1,4-phenylene diamine,2,4-dihydroxy-1,4-phenylene diamine, 2-carboxylic acid-1,4-phenylenediamine, 1,5-phenylene diamine, 2-methyl-1,5-phenylene diamine,2,3-dimethyl-1,5-phenylene diamine, 2,3,4-trimethyl-1,5-phenylenediamine, 2,3,4,6-tetramethyl-phenylene diamine, 2-ethyl-1,5-phenylenediamine, 2-amino-1,5-phenylene diamine, 2-hydroxy-1,5-phenylene diamine,2,4-dihydroxy-1,5-phenylene diamine, 2-carboxylic acid-1,5-phenylenediamine, 1,2,5-phenylene triamine, 2-hydroxy-1,5-phenylene diamine,2,3-dihydroxy-1,5-phenylene diamine, 2,3,4-trihydroxy-1,5-phenylenediamine, 1,4-cyclohexane diamine, 2-methyl-1,4-cyclohexane diamine,2,3-dimethyl-1,4-cyclohexane diamine, 2,3,5-trimethyl-1,4-cyclohexanediamine, 2,3,5,6-tetramethyl-1,4-cyclohexane diamine,2-ethyl-1,4-cyclohexane diamine, 2-hydroxy-1,4-cyclohexane diamine,2,4-carboxylic acid-1,4-cyclohexane diamine, 1,2,5-cyclohexane triamine,1,2,3,5-cyclohexane tetramine, 2-hydroxy-1,4-cyclohexane diamine,2,3-dihydroxy-1,4-cyclohexane diamine, 2,3,4-trihydroxy-1,5-cyclohexanediamine, 2,3,4,6-tetrahydroxy-1,5-phenylene diamine, 1,2-cyclopentanediamine, 3-methyl-1,2-cyclopentane diamine, 3-hydroxy-1,2-cyclopentanediamine, 3-ethyl-1,2-cyclopentane diamine, 3-amino-1,2-cyclopentanediamine, 3-carboxylic acid-1,2-cyclopentane diamine,3,4-dihydroxy-1,2-cyclopentane diamine, 1,4-pentane diamine,3-methyl-1,4-cyclopentane diamine, 3-hydroxy-1,4-cyclopentane diamine,3-ethyl-1,4-cyclopentane diamine, 3-amino-1,4-cyclopentane diamine,3-carboxylic acid-1,4-cyclopentane diamine,2,3-dimethyl-1,4-cyclopentane diamine, 2,3-dihydroxy-1,4-cyclopentanediamine, 3,4,5-trihydroxy-1,2-cyclopentane diamine,2,3,5-trihydroxy-1,4-cyclopentane diamine,3,4,5-trimethyl-1,2-cyclopentane diamine and2,3,5-trimethyl-1,4-cyclopentane diamine.

The expressions epoxy resins and polyepoxides are used hereininterchangeably to refer to the broad class of epoxy-containingreactants which react with the imide-amine curing agents to produce ahard infusible resin product. The polyepoxide can be a single compoundcontaining at least two epoxy groups in which case it is a diepoxide. Itcan also contain a variety of molecular species having a varying numberof epoxy groups per molecular such that the average number of epoxygroups per molecule, that is the epoxy equivalent value, is specified.The epoxy equivalent value of these polyepoxides comprising a mixture ofmolecular species is greater than one and is preferably about two ormore, but will generally not be a whole integer. The epoxy equivalentvalue is obtained by dividing the average molecular weight of thepolyepoxide by its epoxide equivalent weight (grams of the polyepoxidecontaining one gram equivalent of epoxide). The polyepoxide can bealiphatic, cycloaliphatic, aromatic, heterocyclic mixtures of these,saturated or unsaturated, and the like. It can be liquid or solid butmust be soluble in the resin solution, or if not soluble capable offorming a homogeneous dispersion in the resin solution.

This broad class of epoxy resins which is useful in forming theepoxy-containing polymer with this resin-forming solution is exemplifiedby reference to several of the better known types. The glycidyl group ofepoxy resins is an important and useful type of epoxy resin. This groupincludes the glycidyl ethers, the glycidyl esters, the glycidyl amines,and the like. The glycidyl ethers include the glycidyl ethers ofmononuclear polyhydric phenols, polynuclear polyhydric phenols and thealiphatic polyols. They may be single compounds or more commonly are amixture of compounds, some of which are polymeric in nature.Illustrative of glycidyl ethers are the di- or polyglycidyl ethers ofethylene glycol; trimethylene glycol; glycerol; diglycerol; erythritol;mannitol; sorbitol; polyallyl alcohol; butanediol; hydrogenatedbisphenol A; and the like.

The glycidyl ethers of polyhydric phenols include the glycidyl ethers ofresorcinol; hydroquinone; catechol; pyrogallol; and the like as well asthe glycidyl ethers of polynuclear phenols such as bisphenol A;bis(4-hydroxyphenyl)methane, and the like, and glycidyl ethers of thenovolac resins such as bisphenol F and the like. The epoxy resins alsoinclude epoxidized olefins generally based on naturally occuring oils,such as epoxidized soybean oil, epoxidized cotton seed oil, epoxidizedcastor oil, epoxidized linseed oil, epoxidized menhaden oil, epoxidizedlard oil and the like, but also including epoxidized butadiene,epoxidized polybutandiene, and the like.

Preferred epoxy resins for use in the invention are polyglycidylderivatives of aminophenols having the formula: ##STR16## wherein m is 1to 2. The preferred polyglycidyl derivative of aminophenol at thepresent time is triglycidyl p-aminophenol (m is 1). The polyglycidylderivatives of aminophenols are normally fluid, viscous materials whichare commercially available. Such polyglycidyl aminophenols can beprepared according to the disclosures of Reinking et al U.S. Pat. No.2,951,825.

If desired, other co-curing agents can be joined together with theimide-amine component of the invention. Such co-curing agents, includefor instance, anhydrides such as maleic anhydride, succinic anhydride,phthalic anhydride, tetrahydrophthalic anhydride, NADIC methylanhydride, pyromellitic anhydride, and the like.

In forming the compositions of the present invention, the imide-amideand epoxy resin components will be used in amounts sufficient to providean effective weight ration I/E of imide-amine:epoxy resin in the rangeof about 0.2-1.3:1, preferably about 0.55-1.1:1, and preferentiallyabout 0.55-1.1:1, and preferentially about 0.6-0.9-5:1. When mixedcuring systems are employed, that is curing systems including inaddition to the imide-amine another anhydride curing agent, it ispreferred that at least about 40 percent of the total anhydride plusimide equivalents be provided by the imide-amine component of the mixedcuring systems. In like manner, when mixed epoxy resin systems areemployed, it is preferred that at least 50 percent of the total epoxyequivalents be a polyglycidyl aminophenol component of such mixed epoxyresin compositions. Since solubilization of the imide-amine in theepoxide component is a function of a number of variables, includingparticle size, amount of total imide-amine and/or total epoxy resin,relative amounts of individual imide-amine and/or individual epoxyresin, inter alia, some amount of routine experimentation may berequired to obtain optimal compositions.

Because the epoxy resin systems of this invention are reactive at roomtemperature, mixing of the imide-amine and the epoxy components willpreferentially be accomplished at the job site. The reactive system isreadily prepared by blending the curing agent system comprisingimide-amine preferably having a particle size below about 150 micronsaverage diameter, into the epoxy resin system. In this regard, whenother anhydrides are employed as co-curing agents, the individual curingagents are preferably admixed prior to incorporation into the epoxyresin system, which itself can be a priorly admixed system comprisingtwo or more epoxy resins. When employing mixed epoxy resin systems, theimide-amine component can optionally, but less preferentially be mixedinto one epoxy resin prior to being blended into the other epoxy resinor resins employed. Simple mixing means such as by stirring, ballmilling and the like, is effective to cause substantial solubilizationof the imide-amine in the epoxy resin component. Prior to admixing ofthe imide-amine and epoxy components, it can be advantageous to subjectat least the imide-amine to high shear forces, such as a three-rollmill, to reduce the average particle size, to enhance solubilization ofimide-amine particles. While mixing is preferably accomplished at roomtemperature, gentle heating of the imide-amine/epoxy blend totemperatures below about 50° C. can be employed to abet solubilization,particularly at higher anhydride:epoxy ratios and when using mixedcuring agents and/or mixed epoxy resin systems, without causingsignificant premature gellation of the blend. The blending of theimide-amine and epoxy resin results in a mild, rapid endotherm on theorder of 7° C.-12° C., followed by a gradual return to ambienttemperature.

As aforementioned, because the epoxy resin compositions of the presentinvention are curable at room temperature, the compositions of thisinvention are preferably provided as a two-part system, one partcomprising the imide-amine and other curing agents when employed,together with conventional additives which are not reactive with thecuring agents; and the other part comprising epoxide, together withconventional additives which are not reactive with epoxy resins. Theindividual parts are admixed at the job site and application isaccomplished using the same techniques and equipment generally utilizedwith epoxy resin compositions. Even though curable at room temperatures,the compositions of this invention nevertheless remain workable forperiods in excess of 8 hours before cross-linking has advanced to adegree sufficient to inhibit continued use of the blended compositions.Curing of the compositions can be effected at room temperature butcuring at elevated temperatures below about 150° C. can be beneficialwith respect to ultimate properties and setting times, depending uponthe application. Curing at temperatures above 150° C. does not appear toprovide any appreciable improvement in cured resin properties.

The following examples will serve to illustrate the invention. Unlessotherwise noted, amounts are in parts by weight.

EXAMPLE I ##STR17##

Cyclobutane tetracarboxylicdianhydride (CBTCDA) is reacted withpara-phenylenediamine (PPDA) in a mole ratio of 1:2 according to thefollowing procedure:

A solution of CBTCDA in dimethylformamide (DMF) is introduced dropwiseinto a solution of PPFA in dimethylformamide (DMF) at room temperatureafter four hours, a dark brown solid amide-acid precipitate is formedhaving the structure: ##STR18## A mixture containing pyridine and aceticanhydride in a weight ratio of 3:2 is added to the amide-acid reactionproduct (B) and the temperature is raised to 80° C. The amide acid (B)is thus condensed to the imide-amine (A). The imide-amine (A) obtainedis in solution and is separated by distilling off the solvents anddrying in an air-circulated oven.

Alternately, the amide acid may be condensed to imide anhydride bytemperature alone by heating above 180° C.

EXAMPLE II ##STR19##

p-Ethylaniline (pEA) is reacted with cyclobutanetetracarboxylic aciddianhydride (CBTDA) in a molar ratio of 1:2 to form the imide anhydrideintermediate which is reacted with p-phenylene diamine in a 1:1 molarratio according to the following procedure:

Solid cyclobutanetetracarboxylic acid, 0.2 mols, is added to a stirredreactor containing 0.1 mols p-ethylaniline in dimethylformamide at 0° C.and stirred under a nitrogen blanket until all primary amine hasdisappeared. The precipitated anhydric-amic acid is separated from thesolution and washed once with dimethylformamide. The solid amic acid issuspended in dimethylformamide and 100 ml of a solution containingpyridine and acetic anhydride in a weight ratio of 3:2 is added to thesuspension. The mixture is heated to 80° C. and stirred for 2 hours. Asolution containing 0.1 mols p-phenylenediamine is added to the reactionmixture and stirring is continued at 80° C. for an additional two hours.The diimide-amine is recovered from solution by distilling off thesolvent in a stream of nitrogen.

EXAMPLE III ##STR20##

The imide-amine of the Example is obtained by the following procedure:

To a dimethylformamide solution containing 0.1 mols methylamine, 0.2mols cyclobutanetetracarboxylic acid is added. The reaction vessel ismaintained at 0° C. As soon as the cyclobutanetetracarboxylic acid isdissolved, the reaction vessel is brought to a temperature of 50° C. Thesolution is stirred at 50° C. until there is no free amine in thesolution. The temperature is then raised until the dimethylformamiderefluxes gently (153° C.). After refluxing for one hour, the solution iscooled to room temperature and 0.1 mol cyclobutane-1,3-diamine is addedto the solution. The reaction vessel is heated to 80° C. and 100 ml ofsolution containing pyridine and acetic anhydride in a weight ratio of3:2 is added and stirring is continued at 80° C. for an additional twohours. The diimide-amine is recovered from solution by distilling offsolvent in a stream of nitrogen.

EXAMPLE IV

11.1 grams of triglycidyl para-amino phenol (TGPAP) and 2.97 grams ofthe imide-amine of Example I are hand-mixed, poured into a bar-mold andcured at 120° C. for 3 hours and post cured at 204° C. for another 3hours.

The imide-amine curing agent successfully cured the epoxy resin systemin the same manner as commercial anhydride curing agent and examinationof the cured epoxy-imide systems under a polarizing like microscope willshow a homogeneous one phase structure indicating complete solubility ofthe imide anhydride in the epoxy resin.

Differential Scanning Colorimetry and Thermogravimetric Analysis showthat the thermal softening point of the resulting cured epoxy/imidesystem is in excess of 300° C.

The imide-amine/epoxy resin compositions of this invention can be usedin adhesive, casting, molding, potting and encapsulation, coating,laminating, reinforced plastic, and the like applications to affordultimate products having useful high temperature properties. The baseepoxy resin compositions can also be used to modify, or can be modifiedby other epoxy resin systems; and other liquid and/or solid anhydridescan be employed as cocuring agents. The base epoxy resin compositionscan be modified also by the incorporation of other resinous film formingmaterial, such as polybutadiene, hydroxy- and -carboxy-functionalpolybutadiene polyamides, and the like to improve flexibility, impactresistance, etc. There may be incorporated into the compositions of theinvention, whether or not modified, those additives conventionallyemployed with epoxy resin compositions including, without limitationthereto, solvents, fillers, particularly metal and conductive metallicfillers, plasticizers, flexibilizers, reinforcing fibers, carboxylicacids, inorganic acids, free radical sources, coupling agents such aspoly-functional organosilanes and the like, antioxidants, catalysts, andthe like.

The other epoxy resins which can be combined with the base epoxy resincompositions of the invention can be broadly described as organicmaterials having a plurality of reactive 1,2-epoxy groups. Such epoxymaterials can be monomeric or polymeric, saturated or unsaturated,aliphatic, cycloaliphatic, aromatic or heterocyclic, and they may besubstituted if desired with substituents other than epoxy groups, suchas hydroxyl groups, either radicals, halogen atoms, and the like.Representative epoxy materials include, without limitation thereto,epoxy polyethers obtained by reacting an epihalohydrin with a polyhydricphenol or a polyhyric alcohol; polyepoxy-polyhydroxypolyethers obtainedby reacting a polyepoxide with a polyhydric phenol or a polyhydricalcohol; epoxy novolaks; and the like. Further details of epoxyco-reactants which can be employed according to the present inventioncan be found in U.S. Pat. Nos. 2,633,548; 2,872,427; 2,884,408; and3,759,914, among others.

What is claimed is:
 1. Imide-amine compounds having the structure##STR21## wherein -- 1 -- is a divalent cycloaliphatic or aromaticradical selected from the group consisting of ##STR22## is a tetravalentcycloaliphatic or aromatic radical selected from the group consisting of##STR23## R and R² can be the same or different and each is selectedfrom the group consisting of hydrogen, halogen, alkyl group having from1 to 4 carbon atoms, hydroxyl; with the proviso that, in all cases,either -- 1 -- must be ##STR24##
 2. The imide-amine compound accordingto claim 1 having the structure ##STR25##
 3. The imide-amine compoundaccording to claim 1 having the structure ##STR26##
 4. The imide-aminecompound according to claim 1 having the structure ##STR27##